Archgen plans first 3D-stacked chip tape-out for April 2027

Archgen, a Y Combinator startup, says it plans to tape out its first 3D-stacked chip in April 2027.

The company designs chips that stack transistors in layers to shorten signal paths and reduce power, and says it is working with large fabs on the tape-out.

Archgen also claims its thermal model predicts chip temperature about 5,000 times faster than standard design software, and that its designs use up to 40% less power for the same work. These figures are company claims, and no independent verification is reported.