Hikvision wins CIIF 2026 industrial automation award for AI ultrasonic inspection

AIHikvision unveiled more than 100 scenario digitalization products and over ten new models at the 2026 China International Industry Fair in Shanghai, held October 12–16. Its highlights include a high-precision semiconductor packaging 3D AXI inspection device that detects micro-defects smaller than 1 micron. The company also said its ultrasonic inspection products reach a defect recognition accuracy of at least 99.5% and a missed-detection rate of no more than 0.5% in new energy vehicle component testing.

AIHikvision won the Industrial Automation Award at the 2026 China International Industry Fair (CIIF) on October 12 for its AI ultrasonic inspection technology. The company's ultrasonic large model analyzes raw ultrasonic signals for defect location, size, type and area, with phased-array accuracy of 0.1 mm and 5-micron defect detection on MLCC components. In one new energy vehicle parts project, defect identification accuracy is at least 99.5% and the miss rate is at most 0.5%.