Hikvision shows AI-driven industrial sensing and inspection products at 2026 CIIF

Hikvision unveiled more than 100 scenario digitalization products and over ten new models at the 2026 China International Industry Fair in Shanghai, held October 12–16.

Its highlights include a high-precision semiconductor packaging 3D AXI inspection device that detects micro-defects smaller than 1 micron.

The company also said its ultrasonic inspection products reach a defect recognition accuracy of at least 99.5% and a missed-detection rate of no more than 0.5% in new energy vehicle component testing.