NVIDIA and suppliers plan to expand substrate, packaging and testing capacity for AI chips
Overview
NVIDIA announces plans with supply chain partners to expand global manufacturing capacity for its accelerated computing and AI factory platform.
NVIDIA says it will increase substrate capacity for its products 2.5x over three years, with substrate supply from IBIDEN, Samsung Electro-Mechanics and Unimicron.
Amkor plans to raise its advanced packaging capacity more than 300% by the end of 2028, according to the NVIDIA announcement. KYEC will build new U.S. testing facilities, supported by a $1.1 billion capacity reservation advance from NVIDIA, with high-volume production targeted for April 2027.
Written by AI from the articles below · updated Oct 21, 7:13 AM ET
Check the sources:
Article timeline
The articles in this story. Times are ET.
- NVIDIA NewsroomOfficialPickNVIDIA and supply chain partners expand capacity to accelerate AI infrastructure buildout
AINVIDIA says it will increase substrate capacity 2.5x over three years through agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron. Amkor plans to raise advanced packaging capacity more than 300% by the end of 2028, and KYEC will build new U.S. facilities supported by a $1.1 billion capacity reservation advance from NVIDIA.
Heat Trend
Not enough continuous observations to show a trend yet.