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NVIDIA and supply chain partners expand capacity to accelerate AI infrastructure buildout

AINVIDIA says it will increase substrate capacity 2.5x over three years through agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron. Amkor plans to raise advanced packaging capacity more than 300% by the end of 2028, and KYEC will build new U.S. facilities supported by a $1.1 billion capacity reservation advance from NVIDIA.

AIWhy it matters.

The announcement names specific partners, facilities and capacity targets, showing how supply constraints on AI infrastructure are being addressed.

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