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SemiAnalysis describes copper/diamond composites as advanced packaging heat spreaders

1 article1 sourcesince Oct 11Last article 1h ago ·

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SemiAnalysis reports that copper/diamond composites shown at Semicon Taiwan reached about 800 W/m·K thermal conductivity, against about 400 W/m·K for pure copper.

The composites can also be tuned to a coefficient of thermal expansion of roughly 6–10 ppm/K, closer to silicon's ~3 ppm/K than copper's ~17 ppm/K, which reduces warpage in packages.

SemiAnalysis says the main obstacle is the copper–diamond interface. Carbide-forming elements such as Ti, Cr, Mo, or W are added to bond the two materials, and excess carbide lowers conductivity.

Written by AI from the articles below · updated Oct 11, 3:27 PM ET

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Latest developmentOct 11, 3:01 PM ET
Copper/diamond composites emerge as advanced packaging heat-spreader materials

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Oct 11
  1. SemiAnalysisX
    Copper/diamond composites emerge as advanced packaging heat-spreader materials

    AIAt Semicon Taiwan, Cu/diamond composites reached about 800 W/m·K thermal conductivity, versus about 400 W/m·K for pure copper, SemiAnalysis reports. The composites can also be tuned to roughly 6–10 ppm/K CTE, closer to silicon's ~3 ppm/K than copper's ~17 ppm/K, reducing warpage. The main obstacle is the copper–diamond interface, where carbide-forming elements such as Ti, Cr, Mo, or W are added, and excess carbide lowers conductivity.

    Image from @SemiAnalysis_'s post

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