Shanghai Kairuien launches domestic fluid-forming wafer protection material for chip packaging
Overview
Shanghai Kairuien Semiconductor Technology says it has developed a fluid-forming wafer protection material and matching hot-press molding equipment after nearly seven years of research.
The material is designed to replace the patented protective tape used by foreign suppliers in wafer-level processing.
The company says the product is already used in advanced chip packaging and is in multiple process validations with chipmakers for wafer thinning and wafer dicing protection. The company also says the technology is internationally leading, a claim the report attributes only to the company.
Written by AI from the articles below · updated Nov 3, 7:15 AM ET
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- LeiphoneNewsShanghai Kairuien develops domestic fluid-forming wafer protection material for advanced packaging
AIShanghai Kairuien Semiconductor Technology says it has developed a fluid-forming material and matching hot-press molding equipment for wafer-level process protection after nearly seven years of research. The company says the material, which avoids the patented protective tape used by foreign suppliers, is already used in advanced chip packaging and is in multiple process validations with chipmakers in wafer thinning and wafer dicing protection.
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