Shanghai Kairuien develops domestic fluid-forming wafer protection material for advanced packaging
AIShanghai Kairuien Semiconductor Technology says it has developed a fluid-forming material and matching hot-press molding equipment for wafer-level process protection after nearly seven years of research. The company says the material, which avoids the patented protective tape used by foreign suppliers, is already used in advanced chip packaging and is in multiple process validations with chipmakers in wafer thinning and wafer dicing protection.