MemSilicon completes tape-out of 1Gb 1T4R RRAM chip MountTai 2026

AIMemSilicon says it completed tape-out of MountTai 2026, a 28nm 1Gb RRAM chip using a 1T4R cell structure, on October 12. The company reports 30Mb per square millimeter density, access latency under 20 nanoseconds, and on-die error correction, and it says the chip is now in validation. The company targets on-chip storage for model weights and KV cache in SoCs, embodied AI devices, and AI PCs, but its claim to be the world's first chip of this type has not been independently verified.

AIMemSilicon says it has completed tape-out of Mountain Tai One, its first high-density, high-capacity 1T4R RRAM chip, on October 12, 2026. The 1Gb chip is built on a 28nm CMOS process with a density of 30Mb/mm² and access latency under 20ns, and it is now in verification. The company says the design integrates on-chip hardware error correction and a set of circuit-level techniques for reliability and low power.