MemSilicon completes tape-out of 1Gb 1T4R RRAM chip Mountain Tai One
Original title (Chinese)
MemSilicon完成国际首款高密度、大容量1T4R 1Gb RRAM芯片流片
AISummary
MemSilicon says it has completed tape-out of Mountain Tai One, its first high-density, high-capacity 1T4R RRAM chip, on October 12, 2026.
The 1Gb chip is built on a 28nm CMOS process with a density of 30Mb/mm² and access latency under 20ns, and it is now in verification.
The company says the design integrates on-chip hardware error correction and a set of circuit-level techniques for reliability and low power.
AIWhy it matters
The source gives specific density, capacity, and latency figures for the 1T4R design, showing how shared transistors aim to raise RRAM storage density on-chip.
Source: QbitAI · qbitai.comPublished · added here