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SemiAnalysis says ASML is likely building a die-to-wafer hybrid bonding tool

2 articles2 sourcessince Oct 15Last article 1h ago ·

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SemiAnalysis says ASML is likely building a die-to-wafer hybrid bonding tool, though ASML has not announced one.

The estimate rests on 27 bonding patent families ASML filed between December 2022 and November 2024, according to the firm's newsletter article. The design moves each die on its own holder along a track past process stations, and SemiAnalysis says ASML could draw on its alignment and particle-control expertise from lithography.

SemiAnalysis also says advanced logic chipmakers will likely adopt the tool first, which would weigh on Besi's business. The initial report was a social media post from @SemiAnalysis_ that linked to the full article.

Written by AI from the articles below · updated Oct 15, 4:08 PM ET

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Latest developmentOct 15, 3:49 PM ET
ASML is building a hybrid bonding tool, SemiAnalysis reports

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The articles in this story. Times are ET.

Oct 15
  1. SemiAnalysisX
    ASML is building a hybrid bonding tool, SemiAnalysis reports

    AISemiAnalysis reports that ASML is building a hybrid bonding tool. The post links to a newsletter article with details on the tool.

  2. SemiAnalysisBlog
    ASML is likely building a die-to-wafer hybrid bonding tool

    AISemiAnalysis says ASML has not announced a hybrid bonding tool but is likely building a die-to-wafer machine, based on 27 bonding patent families filed between December 2022 and November 2024. The design moves each die on its own holder along a track past process stations, and ASML may draw on its alignment and particle-control expertise from lithography. The analysis also says advanced logic will likely adopt it first, which would weigh on Besi's business.

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