ASML is likely building a die-to-wafer hybrid bonding tool

SemiAnalysis says ASML has not announced a hybrid bonding tool but is likely building a die-to-wafer machine, based on 27 bonding patent families filed between December 2022 and November 2024.

The design moves each die on its own holder along a track past process stations, and ASML may draw on its alignment and particle-control expertise from lithography.

The analysis also says advanced logic will likely adopt it first, which would weigh on Besi's business.