Hua Hong plans to expand silicon photonics capacity in 2027
Overview
Hua Hong chairman and president Bai Peng says the company plans to significantly expand its silicon photonics capacity during its next major capacity expansion in 2027.
Speaking on an earnings call with analysts, he said silicon photonics, used in AI optical modules, is one of two areas where the company wants to add significantly more capacity, along with power management chips.
Written by AI from the articles below · updated Nov 5, 9:10 AM ET
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- South China Morning Post · TechNewsHua Hong plans to expand silicon photonics capacity for AI optical modules in 2027
AIHua Hong chairman and president Bai Peng said on an earnings call that the company plans to significantly expand its silicon photonics footprint during its next major capacity expansion in 2027. He said silicon photonics, used in AI optical modules, is one of two areas, along with power management chips, where the company wants to add significantly more capacity.
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