Hua Hong plans to expand silicon photonics capacity for AI optical modules in 2027
AIHua Hong chairman and president Bai Peng said on an earnings call that the company plans to significantly expand its silicon photonics footprint during its next major capacity expansion in 2027. He said silicon photonics, used in AI optical modules, is one of two areas, along with power management chips, where the company wants to add significantly more capacity.
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South China Morning Post · Tech · Ann Cao · scmp.comPublished · added here
Original title: Chinese chipmaker Hua Hong bets big on silicon photonics amid AI boom