ASML expands into hybrid bonding as Chinese chipmakers adopt the packaging technique
AIASML filed 27 patent families for hybrid bonding tools between December 2022 and November 2024, according to a SemiAnalysis report published Thursday. The filings suggest ASML is moving from lithography into back-end chip packaging, and the report says the count could be higher because of publication delays.
Source details
South China Morning Post · Tech · Alice Li,Howard Liu · scmp.comPublished · added here
Original title: ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging technique