Qualcomm says its HBC near-memory architecture cuts AI inference memory bandwidth gap
AIQualcomm says its first-generation high-bandwidth computing (HBC) silicon, now validated in its lab, delivers up to 18 times the memory bandwidth of LPDDR and five times the TB/s-per-watt energy efficiency of HBM4. The architecture places an AI accelerator under a stack of LPDDR memory and will be integrated into the Dragonfly AI250, which Qualcomm expects to sample in the first half of 2027.
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The Next Platform · nextplatform.comPublished
Original title: Qualcomm Has Eyes On The AI Inference Datacenter With HBC And AI250