SemiAnalysis says 2.5D chip packaging is moving toward 3.5D as yield becomes critical

SemiAnalysis says 2.5D packaging is moving toward 3.5D to overcome reticle-limited lateral scaling, with tighter die-to-die pitch, higher bandwidth density and lower energy per bit.

The firm says higher integration density makes yield critical, because losses at any step compound into final yield.

The post also says that more HBM stacks, chiplets and bonding interfaces add complexity, and that some defects appear only late in the flow. It concludes that this raises the need for advanced inspection.