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BOE says it has shipped 24-layer glass substrates for AI chip packaging

1 article1 sourcesince Nov 6Last article 1h ago ·

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BOE says its 1,000-wafer-per-month pilot line has shipped 24-layer glass substrates measuring over 100 by 100 millimeters for AI chip packaging.

BOE says all shipped substrates passed client reliability testing. The claim comes from a post by X.PIN (@thexpin), which says BOE may reach the market before suppliers to Intel and Nvidia. The post does not name the clients that ran the reliability tests.

Written by AI from the articles below · updated Nov 6, 11:45 AM ET

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Latest developmentNov 6, 11:39 AM ET
BOE ships 24-layer glass substrates for AI chip packaging from its pilot line

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Nov 6
  1. X.PINX
    BOE ships 24-layer glass substrates for AI chip packaging from its pilot line

    AIBOE says its 1,000-wafer-per-month pilot line has shipped 24-layer glass substrates measuring over 100 by 100 millimeters for AI chip packaging. All of the shipped substrates passed client reliability testing. The post frames BOE as possibly reaching market before Intel and Nvidia's suppliers.

    Image from @thexpin's post

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