CXMT expects to introduce a DDR5 RDIMM product by year-end, president Cao Kanyu said. The server-memory chip will combine a 4F² DRAM architecture with hybrid bonding, two technologies aimed at raising density and performance.
The industry still mainly uses 6F² designs. Moving to 4F² can raise memory density by 30% to 50% in the same area.
It marks CXMT's first move into high-speed server memory, a way to win share beyond consumer devices.
