Intel Panther Lake teardown reveals 18A RibbonFET and PowerVia design details

SemiAnalysis tore down Intel's Panther Lake chip, examining its 18A process with RibbonFET gate-all-around transistors and PowerVia backside power delivery.

Measurements put 18A compute logic and TSMC N3E GPU logic at similar logic density, though 18A does not lead TSMC N3P, N2, or Samsung SF2 in peak density.

The analysis also compares the compute, GPU, I/O, and Foveros-S packaging against Lunar Lake and Samsung's SF2 process.