Open hardware. Open networking. Open software.
Co-engineered with @Meta and the OCP community, AMD Helios brings together more than 20 open components, high-performance networking and ROCm software to scale AI.
AMD Helios brings open hardware, networking and software to AI scaling
AISummary
AMD says its Helios platform was co-engineered with Meta and the OCP community to scale AI. The platform combines more than 20 open components, high-performance networking, and ROCm software.
Post on XView on X
Source: AMD · x.comPublished