Sumitomo Bakelite expands China and Singapore chip packaging materials output
AISumitomo Bakelite says it will add production lines for mould underfill and compression-moulding granules at facilities in Suzhou, China, and Singapore. The expansion is expected to roughly double MUF materials capacity and triple compression-moulding granule capacity compared with current levels.
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South China Morning Post · Tech · Howard Liu · scmp.comPublished · added here
Original title: Japan’s Sumitomo Bakelite expands China chip packaging materials output amid AI boom