Huawei's Kirin 9050 Pro ships with logic-folding chip design
Original title (Chinese)
首款韬定律逻辑折叠芯片量产，麒麟9050让华为旗舰手机玩出什么新花样？
Huawei says the Kirin 9050 Pro is its first mass-produced logic-folding chip, stacking circuit layers and linking them with over 50 million hybrid-bonding interconnects.
Compared with the Kirin 9030 Pro in the Mate 80 Pro Max, Huawei reports a 12.7% higher CPU clock, 25% higher CPU performance, 40% higher GPU performance, and 140% higher NPU compute.
Huawei also says a 30B MoE model runs on the device with under 2.5GB of added memory, and that its next-generation Kirin 2027 chip is in testing.
The report explains how logic folding changes chip layout and links it to measured CPU, GPU, and NPU gains on the Kirin 9050 Pro, with its open questions on yield and heat.
Source: Leiphone · leiphone.comPublished · added here