# Houmo Intelligence closes multibillion-yuan Series B as its edge LLM chip M50 wins 150+ design wins

> Original title: 后摩智能低调完成数十亿元B轮融资，端侧大模型AI芯片进入规模化兑现期

- Source: Leiphone
- Published: 2026-11-04T02:21:00.000Z
- Bad Influence: https://badinfluence.news/items/l4g98q1xoybpxvub8a8fues54
- Original: https://www.leiphone.com/category/industrynews/cyDQKpjtzDEPhrr8.html

## Summary

Houmo Intelligence has completed a Series B round worth several billion yuan, according to sources, after multiple financings over the past year. The company says its edge large-model AI chip M50 has entered mass production, won more than 150 product design wins and served over 100 customers in under a year. The funds will go to scaling M50 deliveries and developing the next-generation M6X and 3D CIM products.