# BOE ships 24-layer glass substrates for AI chip packaging from its pilot line

> Original title: Intel and Nvidia view glass substrates as the ultimate solution for next-generation AI chip packaging, but Chinese display giant BOE migh...

- Source: X.PIN
- Published: 2026-11-06T16:39:00.000Z
- Bad Influence: https://badinfluence.news/items/dqt0nab3420teupddu7wh6l3u
- Original: https://x.com/thexpin/status/2118744972304466146

## Summary

BOE says its 1,000-wafer-per-month pilot line has shipped 24-layer glass substrates measuring over 100 by 100 millimeters for AI chip packaging. All of the shipped substrates passed client reliability testing. The post frames BOE as possibly reaching market before Intel and Nvidia's suppliers.

## Post

Intel and Nvidia view glass substrates as the ultimate solution for next-generation AI chip packaging, but Chinese display giant BOE might beat their suppliers to market.

BOE recently revealed that its 1,000-wafer-per-month pilot line has already shipped 24-layer glass substrates measuring over 100 by 100 millimeters, all of which passed client reliability testing.

![](https://badinfluence.news/api/img-proxy?u=https%3A%2F%2Fpbs.twimg.com%2Fmedia%2FHWcBrlabEAAisss.png&mode=thumb&exp=1794182400&sig=270b3e4577b67ca7)